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Al SiC (alluminum silicon carbide) is a metallic-based thermal management compound made up of silicon carbide and aluminum. It is used as a packaging material for electronic parts. The combination of aluminum with high volume frac is what it refers to.
Description Al/SiC
Al SiC (Al SiC), a metallic-based thermal management compound made up of aluminum and silica carbide, is an electronic packaging material. In order to prevent thermal failures in electronic circuits, it is the mixture of aluminum with high volume fractions of silicon carbide.
Specifications for Aluminum Matrix Composites
|
Materials |
Density = g/cm3. |
Modulus of Elasticity GPa |
Strength MPa |
Coefficient 10-6 of expansion beats K |
Thermo conductivity W/m |
|
|
SiC/Al |
15vol%SiC/Al |
2.82 |
100+-5 |
560 |
17.0+-1 |
150+-5 |
|
20vol%SiC/Al |
2.85 |
110+-5 |
580 |
16.0+-1 |
160+-5 |
|
|
25vol%SiC/Al |
2.86 |
115+-5 |
600 |
14.3+-1 |
170+-5 |
|
|
30vol%SiC/Al |
2.89 |
125+-5 |
560 |
13.1+-1 |
175+-5 |
|
|
45vol%SiC/Al |
2.92 |
160+-5 |
500 |
11.5+-1 |
190+-5 |
|
|
55vol%SiC/Al |
2.95 |
195+-5 |
450 |
9.5+-1 |
200+-5 |
|
|
60vol%SiC/Al |
2.98 |
200+-5 |
420 |
8.3+-1 |
205+-5 |
|
|
65vol%SiC/Al |
3.01 |
215+-5 |
400 |
7.5+-1 |
210+-5 |
|
|
70vol%SiC/Al |
3.02 |
220+-5 |
380 |
7.0+-1 |
215+-5 |
|
Properties of Aluminum Silicon Carbide Aluminium/SiC
Silicon caride aluminum SiC/Almatrix compounds have many exceptional advantages. They are ideal for high-stability optomechanical system.
Example: (1) Superior structural stability (static rigidity, dynamic stiffness): The elastic modulus of titanium alloy is twice that of the aluminum alloy, while the specific stiffness of the aluminum alloy is three times greater than the titanium alloy. (2) Excellent thermal control stability: The coefficient of thermal expansion of titanium alloy can be as low as 20%, and that of the titanium alloy is 30%.
Aluminum Silicon Carbide - Al/SiC
Al/SiC meets the semiconductor integration needs according to Moore's law. This results in a dramatic increase in silicon chip calorific values, decreased service lives, and "light-weight and thin" electronic packaging development.
In aerospace especially, the use of microwave integrated circuits, power module, and military RF systems chips for packaging analysis has been a prominent trend.
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